Method for burn-in of high power semiconductor devices

Heat exchange – With timer – programmer – time delay – or condition responsive... – Having heating and cooling capability

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16510433, 165908, 165272, 165 64, 165 804, 324760, F25B 2900

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active

055798268

ABSTRACT:
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.

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