Metal fusion bonding – Process – Preplacing solid filler
Patent
1994-11-02
1996-04-09
Bradley, P. Austin
Metal fusion bonding
Process
Preplacing solid filler
228254, B23K 100, B23K 3102
Patent
active
055053670
ABSTRACT:
The bonding pads (18) of a semiconductor chip (12) each may be provided with a solder bump (36) by first screen printing a pattern of solder paste (36) on a heat-resistant, non-wettable surface (24). The chip (12) is then placed on the surface (24) so each bonding pad (18) contacts a portion of the solder paste pattern (36). The solder paste is then reflowed, yielding molten solder that bonds to the bonding pads (18) of the chip, but not to the surface (24). After reflow, the chip, with its now-bumped pads, is removed from the surface for subsequent soldering to a wettable substrate.
REFERENCES:
patent: 4892245 (1990-01-01), Dunaway et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5323947 (1994-06-01), Juskey et al.
"Magnetic Stencil Paste Screening Method," Research Disclosure, Jun. 1991, No. 326, Disclosure No. 32645.
R. R. Tummala and E. J. Rymaszewski, Eds., Microelectronics Packaging Handbook, Van Nostrand Reinhold, 1989, Ch. 6, pp. 361-447.
Degani Yinon
Dudderar Thomas D.
Spadafora John G.
AT&T Corp.
Bradley P. Austin
Knapp Jeffrey T.
Levy Robert B.
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