Method for building three-dimensional models from...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

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C029S428000, C034S380000, C226S001000, C242S570000

Reexamination Certificate

active

10215276

ABSTRACT:
The present invention is a method and apparatus for building three-dimensional models by deposition modeling techniques from moisture-sensitive thermoplastics. A feedstock of thermoplastic modeling material is dried to a low moisture content and supplied to a dispensing head of a modeling apparatus. The dry thermoplastic material is heated in a liquifier and deposited in a predetermined pattern so as to build a three-dimensional model.

REFERENCES:
patent: 3016451 (1962-01-01), Cornell
patent: 3381812 (1968-05-01), Cohen
patent: 3841000 (1974-10-01), Simon
patent: 3917090 (1975-11-01), Montagnino
patent: 4152367 (1979-05-01), Binsack et al.
patent: 4665492 (1987-05-01), Masters
patent: 4749347 (1988-06-01), Valavaara
patent: 4844373 (1989-07-01), Fike, Sr.
patent: 4898314 (1990-02-01), Stroh
patent: 4928897 (1990-05-01), Satou et al.
patent: 4961154 (1990-10-01), Pomerantz et al.
patent: 5059266 (1991-10-01), Yamane et al.
patent: 5121329 (1992-06-01), Crump
patent: 5134569 (1992-07-01), Masters
patent: 5136515 (1992-08-01), Helinski
patent: 5140937 (1992-08-01), Yamane et al.
patent: 5149548 (1992-09-01), Yamane et al.
patent: 5169081 (1992-12-01), Göedderz
patent: 5204055 (1993-04-01), Sachs et al.
patent: 5216616 (1993-06-01), Masters
patent: 5257657 (1993-11-01), Gore
patent: 5263585 (1993-11-01), Lawhon et al.
patent: 5293996 (1994-03-01), Duncan
patent: 5303141 (1994-04-01), Batchelder et al.
patent: 5312224 (1994-05-01), Batchelder et al.
patent: 5340433 (1994-08-01), Crump
patent: 5402351 (1995-03-01), Batchelder et al.
patent: 5474719 (1995-12-01), Fan et al.
patent: 5503785 (1996-04-01), Crump et al.
patent: 5587913 (1996-12-01), Abrams et al.
patent: 5594652 (1997-01-01), Penn et al.
patent: 5695707 (1997-12-01), Almquist et al.
patent: 5738817 (1998-04-01), Danforth et al.
patent: 5764521 (1998-06-01), Batchelder et al.
patent: 5765740 (1998-06-01), Ferguson
patent: 5807437 (1998-09-01), Sachs et al.
patent: 5866058 (1999-02-01), Batchelder et al.
patent: 5893404 (1999-04-01), Mendez et al.
patent: 5900207 (1999-05-01), Danforth et al.
patent: 5932055 (1999-08-01), Newell et al.
patent: 5939008 (1999-08-01), Comb et al.
patent: 5943235 (1999-08-01), Earl et al.
patent: 5968561 (1999-10-01), Batchelder et al.
patent: 6004124 (1999-12-01), Swanson et al.
patent: 6022207 (2000-02-01), Dahlin et al.
patent: 6027068 (2000-02-01), Lantsman
patent: 6054077 (2000-04-01), Comb et al.
patent: 6067480 (2000-05-01), Stuffle et al.
patent: 6070107 (2000-05-01), Lombardi et al.
patent: 6085957 (2000-07-01), Zinniel et al.
patent: 6095323 (2000-08-01), Ferguson
patent: 6119567 (2000-09-01), Schindler et al.
patent: 6127492 (2000-10-01), Nagashima et al.
patent: 6129872 (2000-10-01), Jang
patent: 6133355 (2000-10-01), Leyden et al.
patent: 6162378 (2000-12-01), Bedal et al.
patent: 6165406 (2000-12-01), Jang et al.
patent: 6175422 (2001-01-01), Penn et al.
patent: 6193923 (2001-02-01), Leyden et al.
patent: 6214279 (2001-04-01), Yang et al.
patent: 6228923 (2001-05-01), Lombardi et al.
patent: 6257517 (2001-07-01), Babish et al.
patent: 6261077 (2001-07-01), Bishop et al.
patent: 6322728 (2001-11-01), Brodkin et al.
patent: 6572228 (2003-06-01), Kaga et al.
patent: 6645412 (2003-11-01), Priedeman, Jr.
patent: 6685866 (2004-02-01), Swanson et al.
patent: 6722872 (2004-04-01), Swanson et al.
patent: 6730252 (2004-05-01), Teoh et al.
patent: WO 00/62994 (2000-10-01), None
patent: WO 00/78519 (2000-12-01), None
patent: WO 02/06029 (2002-01-01), None
patent: WO 02/093360 (2002-11-01), None
patent: WO 2004/003823 (2004-08-01), None
Paper entitled “High Temperature Fused Deposition Modelling: An Experimental Study Focusing on Modelling Materials”, by F.K. Feenstra, from Time-Compression Technologies '98 Conference (Oct. 13-14, 1998, Nottingham, U.K.).

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