Method for breaking conducting path formed on or in printed-circ

Details Method for breaking conducting path formed on or in printed-circ Method for breaking conducting path formed on or in printed-circ

1994-08-17

1996-07-16

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 94, 216 17, B44C 122, H05K 322

Patent

active

055359035

ABSTRACT:
This invention provides a method for breaking a conducting path formed on or in a printed-circuit board. The method comprises steps of arranging a laser source and the printed-circuit board, irradiating a laser beam from the laser source onto a conductive inner wall portion of a through hole in the printed-circuit board so as to remove the conductive inner wall portion of the through hole from the printed-circuit board, and irradiating the laser beam onto a conductive contacting portion where a wiring pattern contacts with a land so as to remove the contacting portion from the printed-circuit board. This invention also relates to a laser system using the method and a printed-circuit board modified by the method.

REFERENCES:
patent: 5104480 (1992-04-01), Wojnarowski et al.
patent: 5221426 (1993-06-01), Tessier et al.

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