Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate
2005-04-26
2005-04-26
Jones, Deborah (Department: 1775)
Stock material or miscellaneous articles
Composite
Of silicon containing
C428S426000, C428S428000, C428S432000, C428S433000, C428S448000, C428S450000, C428S457000, C428S469000, C428S471000, C428S689000, C428S698000, C428S699000, C428S701000, C428S702000, C428S636000, C428S640000, C428S641000, C428S650000, C428S654000, C428S646000, C428S658000, C428S673000, C428S674000
Reexamination Certificate
active
06884511
ABSTRACT:
Ceramic-containing bodies can be bonded to other ceramic-containing bodies, or to metals or metal-containing bodies, by way of an aluminum-silicon brazing alloy. Such alloys feature high thermal conductivity and a melting range intermediate to Cu—Sil and Au—Si. By depositing a layer of silicon or aluminum, e.g., by vapor deposition, onto a surface of the ceramic-containing body, the formation of deleterious intermetallic phases at the brazing interface is avoided. This technique is particularly useful for joining reaction-bonded silicon carbide (RBSC) composite bodies, and particularly such composite bodies that contain appreciable amounts of aluminum as a metallurgical modification of the residual silicon phase. When the RBSC body contains minor amounts of the aluminum alloying constituent, or none, the metallization layer is not required. The resulting bonded structures have utility as mirrors, as packaging for electronics, and in semiconductor lithography equipment, e.g., as electrostatic chucks for supporting a silicon wafer during the lithography process.
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Hiroso Morimoto, Takashi Tanaka, Tohru Saito and Katsutoshi Yamada, “Effects of brazing temperature on joint properties of SiC fiber reinforced aluminum alloy matrix composites”, Advances in Joining Newer Structural Materials, Proceedings of the International Conference held in Montreal, Canada, Jul. 23-25, 1990, pp. 137-142, published on behalf of the International Institute of Welding by Pergamon Press, Oxford.
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Karandikar Prashant G.
Rossing Barry R.
Jones Deborah
M Cubed Technologies, Inc.
Ramberg Jeffrey R.
Xu Ling
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