Method for boring small holes in substrate material

Details Method for boring small holes in substrate material Method for boring small holes in substrate material

1993-04-02

1994-06-21

Paschall, Mark H.

Electric heating

Metal heating

By arc

21912154, 21912144, 219384, 156646, B23K 9073, B23K 916

Patent

active

053229851

ABSTRACT:
A method for boring small holes in a substrate by disposing electrodes on both sides of a substrate to be machined and applying a voltage between the electrodes so as to perform plasma discharge treatment at a pressure of 10 to 2.times.10.sup.3 Torrs. In another method, the gap of the two electrodes is set to 0.01 to 50 mm and a peak voltage to 10 V to 50,000 V in accordance with the electrode gap within the range of .tau..sub.ON the voltage waveform of 5 .mu.s to 20 seconds. The methods make it possible to quickly and reliably accomplish removal of chips causing clogging, smoothing of the inner walls of the holes and removal of fins in the holes.

REFERENCES:
patent: 3862396 (1975-01-01), Machida et al.
patent: 4425496 (1984-01-01), Le Fur et al.
patent: 4495399 (1985-01-01), Cann
patent: 4534994 (1985-08-01), Feld et al.
patent: 4635358 (1987-01-01), Fritz
patent: 4721550 (1988-01-01), Schumacher, III
patent: 4787957 (1988-11-01), Barkanic et al.

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