Method for bonding wafers

Details Method for bonding wafers Method for bonding wafers

2007-03-20

2007-03-20

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C257SE21122

Reexamination Certificate

active

10905794

ABSTRACT:
A first wafer is provided, and a photosensitive masking-and-bonding pattern is formed on the surface of the first wafer. Then, an etching process using the photosensitive masking-and-bonding pattern as a hard mask is performed to form a wafer pattern on the surface of the first wafer. Finally, the first wafer is bonded to a second wafer with the photosensitive masking-and-bonding pattern.

REFERENCES:
patent: 5699094 (1997-12-01), Burke et al.
patent: 6942750 (2005-09-01), Chou et al.
patent: 2004/0062896 (2004-04-01), Picone et al.
patent: 2005/0215054 (2005-09-01), Rasmussen et al.

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