Method for bonding wafers

Details Method for bonding wafers Method for bonding wafers

2011-08-16

2011-08-16

Sefer, A. (Department: 2893)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE27137, C257SE27144, C257SE27161, C257SE21530, C257SE21088

Reexamination Certificate

active

07998833

ABSTRACT:
The invention relates to a method for bonding wafers along their corresponding surfaces.

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Article entitled: “Schutzkappe für Mikrosysteme,” Hans-Ulrich Ehrke, F&M, Issue 107, 1999, pp. 74-76. {English Abstract translation is attached}.
“SB6/8e Semi-Automated Wafer Bonding System, Precision Wafer Bonding Solution,” http://www.suss.com/products/wafer—bonder/semi—automated—wafer—bonders/sb6-8e, accessed May 19, 2008.

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