Method for bonding thin film thermocouples to ceramics

Batteries: thermoelectric and photoelectric – Thermoelectric – Thermopile

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

136200, 136230, H01L 3528

Patent

active

052155978

ABSTRACT:
A method is provided for adhering a thin film metal thermocouple to a ceramic substrate used in an environment up to 700 degrees Centigrade, such as at a cylinder of an internal combustion engine. The method includes the steps of: depositing a thin layer of a reactive metal on a clean ceramic substrate; and depositing thin layers of platinum and a platinum-10% rhodium alloy forming the respective legs of the thermocouple on the reactive metal layer. The reactive metal layer serves as a bond coat between the thin noble metal thermocouple layers and the ceramic substrate. The thin layers of noble metal are in the range of 1-4 micrometers thick. Preferably, the ceramic substrate is selected from the group consisting of alumina and partially stabilized zirconia. Preferably, the thin layer of reactive metal is in the range of 0.015-0.030 micrometers (15-30 nanometers) thick. The preferred reactive metal is chromium. Other reactive metals may be titanium or zirconium. The thin layer of reactive metal may be deposited by sputtering in ultra high purity argon in a vacuum of approximately 2 milliTorr (0.3 Pascals).

REFERENCES:
patent: 3006978 (1961-10-01), McGrath et al.
patent: 3890456 (1975-07-01), Dils
patent: 3911386 (1975-10-01), Beaudoin et al.
patent: 4040929 (1977-08-01), Bauer et al.
patent: 4050956 (1977-09-01), de Bruin et al.
patent: 4153518 (1979-05-01), Holmes et al.
patent: 4238957 (1980-12-01), Bailey et al.
patent: 4253931 (1981-03-01), Gold et al.
patent: 4342632 (1982-08-01), Heim et al.
patent: 4512863 (1985-04-01), Criss et al.
patent: 4559277 (1985-12-01), Ito
patent: 4563400 (1986-01-01), Criss et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for bonding thin film thermocouples to ceramics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding thin film thermocouples to ceramics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding thin film thermocouples to ceramics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1811809

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.