Method for bonding thermoplastic high molecular weight materials

Details Method for bonding thermoplastic high molecular weight materials Method for bonding thermoplastic high molecular weight materials

1975-04-30

1976-12-14

Van Horn, Charles E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

93DIG1, 156311, 156322, 264234, 264345, 264237, 264348, 264248, 428520, C09J 500, B65C 925

Patent

active

039973867

ABSTRACT:
An improved method for bonding same or different thermoplastic high molecular weight materials is described, in which the respective materials to be bonded are heated until their respective temperatures reach a temperature a little lower than the respective second order transition points, when a pressing force is applied to a butting surface between the materials to be bonded, and after the materials have been in themselves further heated up to a temperature 20.degree. - 50.degree. C higher than the higher second order transition point if the second order transition points of the respective materials are different, the materials are slowly cooled down to a temperature lower than the lower second order transition point.

REFERENCES:
patent: 2520737 (1950-08-01), Romeyn et al.
patent: 2537666 (1951-01-01), Gowing
patent: 2878154 (1959-03-01), Cheney et al.
patent: 3107784 (1963-10-01), Alder et al.
patent: 3240648 (1966-03-01), Bradley
patent: 3573153 (1971-03-01), Ryan
patent: 3616004 (1971-10-01), Samson
patent: 3681167 (1972-08-01), Moore

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