Method for bonding thermally-mismatched elements of a traveling

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228189, B23K 119

Patent

active

055013902

ABSTRACT:
A method for bonding thermally-mismatched elements of a traveling wave tube employs a metallic plate of undulating character. The plate is located at the region of the interface between tube elements formed of materials of materially-differing thermal character such as the ceramic termination piece and an adjacent sever pole piece of copper. Through either a brazing or a sintering process, pluralities of bonds are formed at points of tangency between the plate and the two elements of differing thermal expansion coefficients. As a result, a good heat flow path, accompanied by a more stable r.f. interface, is formed between the materials that is not subject to fracture as are prior art diffusion bonds.

REFERENCES:
patent: 2694852 (1954-11-01), Rogers
patent: 3609471 (1971-09-01), Scace
patent: 3717787 (1973-02-01), Doyle
patent: 4532190 (1985-07-01), Kanbe et al.
patent: 4659611 (1987-04-01), Iwase et al.
patent: 4703884 (1987-11-01), Landingham
patent: 4711386 (1987-12-01), Mizuhara
patent: 4865896 (1989-09-01), Yoshida et al.
patent: 5033666 (1991-07-01), Keusseyan et al.
patent: 5069978 (1991-12-01), Mizuhara
patent: 5217589 (1993-06-01), Arledge et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for bonding thermally-mismatched elements of a traveling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding thermally-mismatched elements of a traveling , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding thermally-mismatched elements of a traveling will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-911433

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.