Method for bonding substrates using molten moisture reactive org

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156152, 156329, 525477, C03C 2700

Patent

active

053891708

ABSTRACT:
Curable adhesive compositions comprise combinations of organosiloxane MQ resins and liquid polyorganosiloxanes of specified viscosity and functionality. The compositions are substantially free of unreactive materials and are applied in the molten state. Depending upon the concentration of reactive groups on the resin and polyorganosiloxane, the compositions may also include a silane containing an average of more than two hydrolyzable groups per molecule. Preferred compositions develop excellent adhesion to a variety of organic and metallic substrates during curing under ambient conditions.

REFERENCES:
patent: 2814601 (1957-11-01), Currie et al.
patent: 4143088 (1979-03-01), Favre et al.
patent: 4485206 (1984-11-01), Inoue et al.
patent: 4515932 (1985-05-01), Chung
patent: 4753977 (1988-06-01), Merrill
patent: 4865920 (1989-09-01), Sweet
patent: 4990364 (1988-06-01), Bolte et al.
patent: 5070121 (1989-11-01), Hinterwald
patent: 5091484 (1992-02-01), Colas et al.
patent: 5162410 (1992-11-01), Sweet
patent: 5210156 (1993-05-01), Clark et al.
Hardman et al., "Silicones", vol. 15, 2nd Edition, pp. 218-219, .COPYRGT.1989.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for bonding substrates using molten moisture reactive org does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding substrates using molten moisture reactive org, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding substrates using molten moisture reactive org will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-284655

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.