Method for bonding substrates

Details Method for bonding substrates Method for bonding substrates

2005-09-20

2005-09-20

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S105000

Reexamination Certificate

active

06946363

ABSTRACT:
A method for bonding diamond heat distribution structures to integrated circuit packages using optical contacting. In one embodiment, a heat spreader comprising diamond slab has a flat contact surface which is polished to a high degree of smoothness. An integrated circuit's package also has a flat contact surface which is polished to a high degree of smoothness. The contact surfaces of the diamond slab and the package are thoroughly cleaned and are then placed in contact with each other, establishing an optical contact bond between them. In one embodiment, the contact surfaces of the diamond and package which are to be bonded together are first polished, then a layer of an intermediate material such as silicon carbide is deposited on the polished surfaces. The silicon carbide layers on the contact surfaces are cleaned and placed in contact with each other to establish an optical contact bond. If desired, the silicon carbide layers on the contact surfaces may be activated with a substance such as hydrogen fluoride to promote bonding.

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International Search Report, application No. PCT/US 01-07874, mailed Nov. 22, 2001.
Haisma et al., “Surface Preparation and Phenomenological Aspects of Direct Bonding,” Philips Journal of Research, vol. 49, 1995, pp. 23-46.
Haisma et al., “Diversity and feasibility of direct bonding: a survey of a dedicated optical technology,” Applied Optics, vol. 33, No. 7, Mar. 1994, pp. 1154-1169.
Haisma et al., “Silicon-Wafer Fabrication and (Potential) Applications of Direct-Bonded Silicon,” Philips Journal of Research, vol. 49, 1995, pp. 65-89.
Haisma et al., “Frameworks for Direct Bonding,” Philips Journal of Research, vol. 49, pp. 11-21.
International Search Report, application No. PCT/US 01-07874, mailed Nov. 22, 2001.

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