Method for bonding substrate, bonded substrate, and direct...

Details Method for bonding substrate, bonded substrate, and direct... Method for bonding substrate, bonded substrate, and direct...

2004-11-04

2009-10-27

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C156S281000, C156S306300, C438S457000

Reexamination Certificate

active

07608520

ABSTRACT:
The present invention relates to a method for laminating substrates, including locating positioning a surface of a first substrate and a surface of a second substrate at positions close to each other, or partially bringing them in partial contact with each other; supplying a volatile liquid between the surface of the first substrate and the surface of the second substrate; and evaporating the volatile liquid so as to laminate the substrates with each other.

REFERENCES:
patent: 4883215 (1989-11-01), Goesele et al.
patent: 5334273 (1994-08-01), Short et al.
patent: 5763288 (1998-06-01), Sakaguchi et al.
patent: 6846723 (2005-01-01), Ohkubo
patent: 6959854 (2005-11-01), Yokokawa et al.
patent: 2003/0037874 (2003-02-01), Liau et al.
patent: 2003/0045030 (2003-03-01), Hayashida et al.
patent: 2003/0190816 (2003-10-01), Buehler et al.
patent: 5-74926 (1993-03-01), None
patent: 05267197 (1993-10-01), None
patent: 6-267804 (1994-09-01), None
patent: 7-283379 (1995-10-01), None
patent: 8-181296 (1996-07-01), None
patent: 9-63912 (1997-03-01), None
patent: 10-297931 (1998-11-01), None
patent: 2000-216365 (2000-08-01), None
patent: 2000216365 (2000-08-01), None
patent: 2001-133475 (2001-05-01), None
patent: 2002-313689 (2002-10-01), None
patent: 2003-140214 (2003-05-01), None

Affiliated with

Also associated with

Rating

Method for bonding substrate, bonded substrate, and direct... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding substrate, bonded substrate, and direct..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding substrate, bonded substrate, and direct... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4081517