Method for bonding small electronic components

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156312, 156320, 156322, 29832, B32B 3100

Patent

active

052960749

ABSTRACT:
A method for rapidly bonding a small electronic component to a mating surface of a high surface energy substrate using an adhesive pad made from a substantially amorphous, solvent-free thermoplastic polymer.

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