Metal fusion bonding – Process – Diffusion type
Patent
1987-02-17
1988-11-15
Ramsey, Kenneth J.
Metal fusion bonding
Process
Diffusion type
228124, 22826312, B23K 104, B23K 2002
Patent
active
047843136
ABSTRACT:
Molded bodies of SiC ceramic can be firmly bonded to each other or to molded bodies of other ceramic material or to metal workpieces by the establishment of diffusion-welding conditions when a metal alloy layer is interposed between cleaned and polished surfaces that are to be joined. The alloy metal of the layer is MnCu or MnCo or multi-component alloys containing the foregoing as a base and additions of other metals to a total percentage not exceeding 70% with each single other metal being present in the range from 2 to 45% by weight. Such other metals constitute 1 or more of Cr, Ti, Zr, Fe, Ni, V and Ta. The Mn, Cu alloy or alloy base has a Cu content from 10 to 90%, preferably 25 to 82% and the MnCo alloy or alloy base has a cobalt content of 5 to 50% by weight. MnCuFe eutectic compositions containing 5 to 30% by weight Fe and 10 to 90% by weight Cu and MnCoCr eutectic compositions with chromium content from 2 to 45% by weight are preferred, especially 50:40:10 MnCuFe and 60:30:10 MnCoCr. Preferred alloy metal layer thickness is from 5 to 200 .mu.m, especially about 10 to 50 .mu.m. In the case of SiSiC bodies, a preliminary treatment to convert free silicon at or near the surface to be joined into silicon nitride or silicon carbide is desirable. The provision of the alloy metal layer between the surfaces to be joined may be performed by interposing an alloy metal foil between the surfaces or by sputtering or vapor-deposition of the alloy on a silicon carbide surface to be joined. The diffusion welding is performed at a temperature lower than the melting point of the alloy layer by 20.degree. to 300.degree. C. while the surfaces to be joined are pressed together with a force of from 0.5 to 60 MPa.
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Kernforschungsanlage Julich Gesellschaft mit beschrankter Haftun
Ramsey Kenneth J.
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