Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2007-06-26
2007-06-26
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S459000
Reexamination Certificate
active
10832267
ABSTRACT:
A method for bonding semiconductor structures together is described. The technique includes providing a bonding surface on each of two semiconductor structures, brushing a bonding surface of at least one of the structures to remove contaminants and to activate hydroxyl groups on the bonding surface to enhance hydrophilicity and to facilitate molecular bonding of the structures, and joining the bonding surfaces together by molecular bonding to form a composite structure.
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Kerdiles Sébastien
Maleville Christophe
Maunand Tussot Corinne
Morales Christophe
Moriceau Hubert
Commissariat à l'Energie Atomique (CEA)
S.O.I.Tec Silicon on Insulator Technologies
Smith Zandra V.
Thomas Toniae M.
Winston & Strawn LLP
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