Method for bonding semiconductor laser element and apparatus the

Details Method for bonding semiconductor laser element and apparatus the Method for bonding semiconductor laser element and apparatus the

1987-09-08

1989-04-04

Godici, Nicholas P.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228105, 228123, 228 9, 228 447, 228 491, 156 64, 29593, 29834, 437209, 219 851, 219 8516, H01S 318, B23K 1100, B23K 1132

Patent

active

048178497

ABSTRACT:
A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).

REFERENCES:
patent: 3448280 (1969-06-01), Blitchington, Jr. et al.
patent: 4443494 (1984-04-01), Gonser
patent: 4457464 (1984-07-01), Klement et al.
patent: 4557043 (1985-12-01), Starski
IBM Technical Disclosure Bulletin, "Testing Method . . . ", vol. 15, No. 6, Nov. 1972.

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