Method for bonding rigid substrates

Details Method for bonding rigid substrates Method for bonding rigid substrates

1998-04-01

1999-12-07

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

With printing or coating of workpiece

Coating or impregnating workpiece before molding or shaping...

264236, 1563077, 1563073, B29C 3502, B29C 6552

Patent

active

059977868

ABSTRACT:
Rigid substrates containing an adhesive composition on at least one surface are prepared by an injection molding operation. The degree of bonding between the adhesive layer and the substrate is greater than can be achieved using conventional methods for coating substrates with adhesive compositions.

REFERENCES:
patent: 3844030 (1974-10-01), Wilkinson
patent: 4327369 (1982-04-01), Kaplan
patent: 4386042 (1983-05-01), Tatebayash
patent: 4555294 (1985-11-01), Adams et al.
patent: 4719065 (1988-01-01), Gibbon
patent: 4785523 (1988-11-01), Koseki et al.
patent: 4810590 (1989-03-01), Rich
patent: 4860425 (1989-08-01), Kunisaki et al.
patent: 4916016 (1990-04-01), Bristowe et al.
patent: 4957677 (1990-09-01), Katoh et al.
patent: 5002548 (1991-03-01), Campbell et al.
patent: 5002625 (1991-03-01), Naritomi et al.
patent: 5160780 (1992-11-01), Ono et al.
patent: 5207961 (1993-05-01), Wank et al.
patent: 5213739 (1993-05-01), Dickerson et al.
patent: 5254302 (1993-10-01), Yamanaka
patent: 5364921 (1994-11-01), Gray et al.

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