Method for bonding polyamides to rubber, adhesive for the same,

Details Method for bonding polyamides to rubber, adhesive for the same, Method for bonding polyamides to rubber, adhesive for the same,

1974-12-09

1976-11-09

Bleutge, John C.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

156334, 156335, 260845, 260846, 260857D, 428474, 428506, C08L 6110, C08L 6112, C08L 6114

Patent

active

039910270

ABSTRACT:
An aqueous alkaline dispersion of a rubbery vinyl pyridine copolymer, trimethylol phenol, and a resorcinol compound, in certain amounts is useful in forming an adhesive for bonding polyamide or nylon cords to rubber compounds or stocks. After dipping the cord in the adhesive dip, the coated cord is heated to dry it and heat cure or heat set the adhesive on the cord. Thereafter, the adhesive containing cord is combined or laminated (calendered) with a curable rubber compound and the resulting assembly is cured. High H-adhesions are obtained with this one-step or single treatment coating dip. It is particularly useful for bonding crystalline polyamides having a large number of aromatic groups in the polymeric structure, e.g., "Fiber B."

REFERENCES:
patent: 3194294 (1965-07-01), van Gils
patent: 3547729 (1970-12-01), Kibler
The Chemistry of Phenolic Resins, Martin, New York, John Wiley & Sons, 1956, p. 111.

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