Method for bonding polyamides to rubber, adhesive for the same,

Details Method for bonding polyamides to rubber, adhesive for the same, Method for bonding polyamides to rubber, adhesive for the same,

1974-12-09

1976-05-11

Van Balen, William J.

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Rod, strand, filament or fiber

428395, 428474, D02G 300

Patent

active

039565661

ABSTRACT:
An aqueous alkaline dispersion of a rubbery vinyl pyridine copolymer, trimethylol phenol, and a resorcinol compound, in certain amounts is useful in forming an adhesive for bonding polyamide or nylon cords to rubber compounds or stocks. After dipping the cord in the adhesive dip, the coated cord is heated to dry it and heat cure or heat set the adhesive on the cord. Thereafter, the adhesive containing cord is combined or laminated (calendered) with a curable rubber compound and the resulting assembly is cured. High H-adhesions are obtained with this one-step or single treatment coating dip. It is particularly useful for bonding crystalline polyamides having a large number of aromatic groups in the polymeric structure, e.g., "Fiber B".

REFERENCES:
patent: 3304222 (1967-02-01), Wilkin
patent: 3364100 (1968-01-01), Danielson
patent: 3547729 (1970-12-01), Kibler
patent: 3760578 (1973-09-01), Kibler
patent: 3843484 (1974-10-01), Kamiyoshi et al.
patent: R23451 (1952-01-01), Mighton

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