Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2004-12-17
2010-11-30
Molles, Kenneth (Department: 2815)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S305000, C156S308400, C156S308600, C156S257000, C156S272600
Reexamination Certificate
active
07842157
ABSTRACT:
Disclosed is a method of bonding upper and lower substrates for manufacturing a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates. According to the method, the upper and lower substrates are bonded by introducing an organic solvent between the upper and lower substrates. In addition, the invention provides a method of manufacturing a micro chip using the method and a micro chip manufactured according to the method. According to the invention, it is possible to easily and precisely bond the upper and lower substrates of the plastic micro chip.
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Chang Jun Keun
Chung Chanil
Hur Dae Sung
Jo Han Sang
Park Jun Ha
Browdy and Neimark PLLC
Digital Bio Technology
Jiang Fang-Xing
Molles Kenneth
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