Method for bonding or potting substrates

Details Method for bonding or potting substrates Method for bonding or potting substrates

1990-03-22

1992-10-13

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562735, 1562755, 1562757, 156277, 156326, 427561, 427517, 427510, B65H 8100, B05D 306

Patent

active

051547910

ABSTRACT:
A method for bonding or potting substrates by means of cationically polymerizable masses being activated before joining or potting by irradiation with visible light and curing after joining or potting of the substrates without the irradiation being continued is described as well as an apparatus for executing this method. By irradiation with light having a wavelength of from 400 to 600 nm for photo-activation of said masses, a prolonged pot life of said masses without reducing their wetting ability during pot life is obtained such that the masses are unlimitedly applicable for more than 30, preferably more than 100 sec. after exposure is finished. The apparatus according to the invention comprises a source of irradiation which exclusively emits light having a wavelength of >400 nm.

REFERENCES:
patent: 4356050 (1982-10-01), Crivello et al.
patent: 4849048 (1989-07-01), Inagaki et al.
patent: 4880486 (1989-11-01), Maeda
patent: 4880662 (1989-11-01), Habrich et al.
patent: 4916805 (1990-04-01), Ellrich et al.

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