Method for bonding materials

Details Method for bonding materials Method for bonding materials

1986-03-03

1990-01-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using only pressure

22826312, 228205, 228218, 228221, 228124, B23K 2024, H01L 4122

Patent

active

048952907

ABSTRACT:
An ultrasonic transducer and its method of fabrication wherein bonding between an impedance matching layer on one side of a piezoelectric layer and a support layer on the other side of the piezoelectric material is made by providing onto each material a smooth, thin gold film on the smooth surfaces of the layers which are to be in contact with one another in the assembled transducer. The layers are bonded to each other by the gold films under moderate temperature and pressure to form the transducer. Sawing of the impedance matching and piezoelectric layers into a plurality of parallel transducers attached to the support layer forms an array.

REFERENCES:
patent: 3066232 (1962-11-01), Branson
patent: 3916836 (1975-10-01), Hafner et al.
patent: 3921885 (1975-11-01), Knox
patent: 4196837 (1980-04-01), Burkart et al.
patent: 4245768 (1981-01-01), Sater
patent: 4247034 (1981-01-01), Burkhart et al.
patent: 4355084 (1982-10-01), Kitchen
Federal Standard 209B entitled, "Clean Room and Work Station Requirements, Controlled Environment", General Services Administration of the USA, pp. 1-5 and cover sheet; Aug. 10, 1966.

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