Method for bonding LLCCC-components using a leadframe

Details Method for bonding LLCCC-components using a leadframe Method for bonding LLCCC-components using a leadframe

1992-06-15

1993-03-30

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437270, H01L 2158, H01L 2160

Patent

active

051983915

ABSTRACT:
A method for electrically bonding surface-mountable integrated circuits (LLCCC-components) onto a printed circuit board. A specially shaped flexible bonding element having a semicircular central portion is used to flexibly connect the LLCCC components to the circuit board so that stresses due to thermal expansion of the components are absorbed.

REFERENCES:
patent: 3906621 (1975-09-01), Epple
patent: 4189085 (1980-02-01), Penrod
patent: 4751199 (1988-06-01), Phy
Elektkonik Industrie-Eine neue LSI-Sehause-Norm Daniell. Amey-pp. 18-20, 1977.

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