Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-06-07
1999-05-11
Maki, Steven D.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563071, 1563073, 1563074, 156335, 264 83, 264109, B27N3/00
Patent
active
059024429
ABSTRACT:
Subjecting lignocellulosic components coated with an aqueous alkaline phenolic resole resin solution to carbon dioxide inhibits overpenetration of resin and improves bond strength when the coated components are heated to cure the resin by application of steam and pressure in the preparation of structural panels. Also, contact with carbon dioxide of high moisture resin coated lignocellulosic components accelerates the speed of cure and improves bond strength of panels cured under heat and pressure.
REFERENCES:
patent: 2757150 (1956-07-01), Heritage
patent: 3303089 (1967-02-01), Roubicek
patent: 3522128 (1970-07-01), Orth
patent: 3637547 (1972-01-01), Orth
patent: 3891738 (1975-06-01), Shen
patent: 4122236 (1978-10-01), Holman
patent: 4283319 (1981-08-01), Konii et al.
patent: 4362203 (1982-12-01), Konii et al.
patent: 4393019 (1983-07-01), Geimer
patent: 4802837 (1989-02-01), Held
patent: 4937024 (1990-06-01), Hickson
patent: 4977209 (1990-12-01), Barker et al.
patent: 5096409 (1992-03-01), Stofko
patent: 5171496 (1992-12-01), Hsu
patent: 5294648 (1994-03-01), Smith et al.
Translation of German Patent 297172.
Abstract for DD 2977172.
Creel Lewis D.
Detlefsen William D.
Phillips Earl K.
Borden Chemical, Inc.
Maki Steven D.
LandOfFree
Method for bonding lignocellulosic material with phenol-formalde does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for bonding lignocellulosic material with phenol-formalde, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding lignocellulosic material with phenol-formalde will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-243761