Method for bonding lead of IC component with electrode

Details Method for bonding lead of IC component with electrode Method for bonding lead of IC component with electrode

1992-06-05

1993-08-31

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228212, H01L 2158

Patent

active

052401707

ABSTRACT:
A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC component held by the mounting device, moving the mounting device toward the circuit board to compress the IC component against the circuit board at the predetermined position while allowing the leads to flex to accommodate for nonuniformity in the heights of metal pieces to be bonded with the electrodes and bending of the circuit board. In this manner, the flat portions of the leads are brought into close contact with the electrodes. The leads are then irradiated with an optical beam so as to melt the metal pieces of the electrodes for bonding of the leads to the circuit board.

REFERENCES:
patent: 4531044 (1985-07-01), Chang
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 4979290 (1990-12-01), Chiba

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