Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-03-24
2010-02-23
Lee, Eugene (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257SE21499, C257SE21510, C438S118000, C438S119000, C156S087000, C156S295000
Reexamination Certificate
active
07666713
ABSTRACT:
A simple method for bonding a heatsink for improving heat-radiating efficiency, comprising the steps of sticking a double-sided adhesive tape to an end portion on an adhesion surface of at least either the heatsink or the semiconductor device; applying an adhesive onto the adhesion surface of at least either the heatsink or the semiconductor device; bringing the end portion into contact with a corresponding portion of the other one of the heatsink or the semiconductor device; and turning at least either the heatsink or the semiconductor device with the contacting portion as a rotation center to bond together the adhesion surfaces of the heatsink and the semiconductor device.
REFERENCES:
patent: 5533256 (1996-07-01), Call et al.
patent: 5686361 (1997-11-01), Ootsuki
patent: 5854664 (1998-12-01), Inoue et al.
patent: 5981310 (1999-11-01), DiGiacomo et al.
patent: 2005/0140028 (2005-06-01), Venkateswaran
Fujitsu Limited
Gumedzoe Peniel M
Kratz Quintos & Hanson, LLP
Lee Eugene
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