Method for bonding flexible printed circuitry to rigid support p

Details Method for bonding flexible printed circuitry to rigid support p Method for bonding flexible printed circuitry to rigid support p

1976-12-27

1980-10-07

Kittle, John E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29834, 156155, 156253, 156330, B41M 308

Patent

active

042266599

ABSTRACT:
A technique is described for bonding flexible printed circuitry to a rigid base plane by means of a tacky contact adhesive which is subsequently cured by heating into a nontacky condition. The procedure involves pressing the adhesive on the surface of a rigid support member to which it adheres and subsequently applying a flexible sheet thereto and laminating under moderate pressure. The adhesive is then removed from through holes with a solvent and the resultant assembly subjected to heating to cure the adhesive. It has been found that the use of this procedure permits removal of the solvent without detrimental solvent retention and also avoids the collecting of debris at the edge of the adhesive layer during subsequent processing and use.

REFERENCES:
patent: 3348990 (1967-10-01), Zimmerman et al.
patent: 3606677 (1971-09-01), Ryan
patent: 3804692 (1974-04-01), Sly

Affiliated with

Also associated with

Rating

Method for bonding flexible printed circuitry to rigid support p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding flexible printed circuitry to rigid support p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding flexible printed circuitry to rigid support p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-617184