Method for bonding expanded polymeric parts

Details Method for bonding expanded polymeric parts Method for bonding expanded polymeric parts

1976-04-14

1977-07-12

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

219 1041, 219 1053, 264 27, 264DIG76, B32B 3126, H05B 904

Patent

active

040352161

ABSTRACT:
A method for bonding expanded polymeric parts without an adhesive. The method comprises wetting the surfaces to be bonded with water or water containing from about 1% to 2% wetting agent, positioning the surfaces to be bonded in a nonmovable abutting relationship, encapsulating the joint formed by the abutting surfaces with a mold, and, while encapsulated, passing high frequency electrical energy therethrough to effectuate a bond.

REFERENCES:
patent: 2859153 (1958-11-01), Zucht
patent: 2992958 (1961-07-01), Yamaguchi
patent: 3060513 (1962-10-01), Klink et al.
patent: 3344222 (1967-09-01), Shapiro et al.
patent: 3738886 (1973-06-01), Southgate

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