Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-03-21
1998-10-06
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438118, H01L 2144
Patent
active
058175423
ABSTRACT:
It is intended to provide method for bonding a bump formed on an electronic component to a circuit pattern on a substrate, the method being capable of preventing defective connection due to breakage of the conductive adhesives. The method interposes the conductive adhesives between the bump and the circuit pattern, injects the insulating adhesives between the electronic component and the substrate while the temperature is raised to a temperature for curing the conductive adhesives, and lowered to the room temperature, and cures the insulating adhesives, whereby the electronic component is firmly attached to the substrate still at a high temperature and the substrate subsequently cooled to the room temperature cannot be substantially deformed.
REFERENCES:
patent: 5138145 (1992-08-01), Nakamura et al.
patent: 5482896 (1996-01-01), Tang
patent: 5489804 (1996-02-01), Pasch
patent: 5579573 (1996-12-01), Baker et al.
patent: 5627108 (1997-05-01), Alibocus et al.
Matsushita Electric - Industrial Co., Ltd.
Picardat Kevin
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