Method for bonding copper-containing surfaces together

Details Method for bonding copper-containing surfaces together Method for bonding copper-containing surfaces together

1997-02-28

1998-08-11

Powell, William

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

Etching improves or promotes adherence of preforms being bonded

216 20, 216105, B44C 122, C23F 100

Patent

active

057923752

ABSTRACT:
Two copper containing surfaces are bonded together by microetching at least one of the surfaces, followed by abutting the two surfaces together, and then laminating them at a temperature of at least about 300.degree. C. and below the decomposition temperature of the copper-containing surfaces, and at a pressure of at least about 1500 psi.

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Nichting, R.A. et al, Low-Temperature Solid-State Bonding of Copper, Journal of Materials Engineering and Performance (1992) 1:35-44.

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