Method for bonding an LSI chip on a wiring base

Details Method for bonding an LSI chip on a wiring base Method for bonding an LSI chip on a wiring base

1985-12-09

1988-05-17

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156256, 1562739, 1562755, 1562757, 156297, 156311, 174117A, 361409, 361411, B29C 6502, B29C 6530, B29C 6548, B29C 6554

Patent

active

047448504

ABSTRACT:
A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.

REFERENCES:
patent: 3981070 (1976-09-01), Buelow
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4126292 (1978-11-01), Saeki et al.
patent: 4157932 (1979-06-01), Hirata
patent: 4460804 (1984-07-01), Suejkousky
Emerson & Cuming, Inc., ECCOBOND.RTM. Adhesives, 8-1-68, pp. 2-4.

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