Method for bonding a wire and bonding apparatus

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228111, 228179, 228230, 228 11, 228 45, 219 5621, 219 95, 219 1047, 219 1053, 219 8518, B23K 2010

Patent

active

048219444

ABSTRACT:
The method for bonding a wire of this invention comprises the steps of: positioning a metal ball or a wire on a material (to be bonded); applying a pressing force on the metal ball or the wire against the material (to be bonded) and deforming it; inducing eddy currents in the wire to generate heat energy, whereby elements of the wire and the material (to be bonded) are mutually diffused by means of the heat energy and the pressing force, and bonding is completed. The wire bonding apparatus of this invention comprises: a capillary tip having a through-hole which opens onto a end thereof and through which a wire is passed, the capillary tip pressing the wire against a material to be bonded by the end of the tip (flat face); an electromagnetic coil provided around the end of the capillary tip to surround the through-hole; and a power source for supplying a high-frequency current to the electromagnetic coil.

REFERENCES:
patent: 3497952 (1970-03-01), King et al.
patent: 3891822 (1975-06-01), Laub et al.
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4586642 (1986-05-01), Dreibelbis et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for bonding a wire and bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding a wire and bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding a wire and bonding apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2391843

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.