Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1988-11-10
1989-08-29
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 228193, 228195, 22826312, C04B 3702
Patent
active
048609390
ABSTRACT:
Disclosed is a method for the direct bonding of a copper sheet to a substrate made of an electrically insulating material, with the heating of the copper/substrate set in order to obtain a eutectic mixture. The method according to the invention consists in cleaning the copper to eliminate traces of oxidation on its surface before placing said copper on the substrate, in heating the copper/substrate set under a neutral atmosphere until a temperature greater than the temperature for the formation of the eutectic mixture is reached, and in applying the oxidating reactive gas only after the temperature greater than the temperature for the formation of the eutectic mixture is reached, in such a way that this temperature is reached before any oxidation of the surface of the copper.
REFERENCES:
patent: 2517248 (1950-08-01), Semeyn
patent: 3517432 (1970-06-01), Sandstrom
patent: 3911553 (1975-10-01), Burgess et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4050956 (1977-09-01), de Bruin et al.
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4563383 (1986-01-01), Kuneman et al.
patent: 4591401 (1986-05-01), Neidig et al.
patent: 4693409 (1987-09-01), Mizunoya et al.
Patent Abstracts of Japan, vol. 9, No. 318, 12-1985, JP-A-60 150 653, Toshiba KK, 8-1985.
Guinet Jannick
Hubert Jean-Claude
Martial Marie-Francoise
Drucker William A.
Godici Nicholas P.
Heinrich Samuel M.
La Telemecanique Electrique
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