Method for bonding a ceramic to a metal with a copper-containing

Details Method for bonding a ceramic to a metal with a copper-containing Method for bonding a ceramic to a metal with a copper-containing

1997-07-09

2000-05-02

Ryan, Patrick

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281241, 2281245, 228195, B23K 3102

Patent

active

060561866

ABSTRACT:
A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are placed in contact with a ceramic layer and metal layer. The assembly, so formed, is then heated to a temperature at least equal to the melting point of the eutectic and no greater than the melting temperature of copper. Upon cooling of the eutectic, a bond forms bond the ceramic layer to the metal layer.

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