Method for batch cleaving semiconductor wafers and coating cleav

Details Method for batch cleaving semiconductor wafers and coating cleav Method for batch cleaving semiconductor wafers and coating cleav

1991-01-30

1992-12-15

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437227, 437129, H01L 21302, H01L 21304

Patent

active

051717174

ABSTRACT:
A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer, provided with scribe lines defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands and guiding it around a curved, large radius surface thereby applying a bending moment. With a moment of sufficient magnitude, individual bars are broken off the wafer as this is advanced, the bars having front-and rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighboring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.

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patent: 4951601 (1990-08-01), Maydan et al.
patent: 4995539 (1991-02-01), Richard
patent: 5000817 (1991-03-01), Aine

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