Method for avoiding die cracking

Details Method for avoiding die cracking Method for avoiding die cracking

2008-11-18

2010-10-12

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C257SE21508

Reexamination Certificate

active

07811853

ABSTRACT:
Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a plurality of dies separated from each other by at least a dielectric material, removing the dielectric material substantially down to the substrate to form gaps between the plurality of dies, and singulating the plurality of dies along the gaps between the plurality of dies.

REFERENCES:
patent: 7417305 (2008-08-01), Jiang et al.
patent: 2005/0266661 (2005-12-01), Li et al.
patent: 2006/0043364 (2006-03-01), Jiang et al.
patent: 2006/0166465 (2006-07-01), Ono
patent: 2006/0246626 (2006-11-01), Jiang et al.

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