Method for automatically mounting non-lead electronic components

Details Method for automatically mounting non-lead electronic components Method for automatically mounting non-lead electronic components

1983-12-19

1985-03-12

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

H05K 330

Patent

active

045036071

ABSTRACT:
A method and an apparatus for automatically mounting, on printed circuit boards, non-lead electronic components which are stored mutually independently within a multiplicity of apertures equally spaced longitudinally in a strip member and is covered with a covering tape. The covering tape is separated first by a covering tape separating assembly from the strip member so as to uncover a leading one of the apertures. A leading portion of the strip member including the uncovered leading aperture is cut off the strip member by a severing assembly consecutively. A plurality of the leading portions cut off the strip members respectively storing different kinds of components are arranged on a transfer element of a transfer assembly in a desired order and transferred to a fixed position by the transfer member. Each component stored in the cut-off leading portions is picked up, transferred and mounted on a printed circuit board one by one. The uncovered and cut-off leading portion is utilized as a part of the transfer assembly.

REFERENCES:
patent: 4054988 (1977-10-01), Masuzima et al.
patent: 4166562 (1979-09-01), Keizer et al.
patent: 4327482 (1982-05-01), Araki et al.
patent: 4346514 (1982-08-01), Makizawa et al.

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