Method for automatically determining the surface quality of...

Details Method for automatically determining the surface quality of... Method for automatically determining the surface quality of...

2005-04-19

2005-04-19

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S007000

Reexamination Certificate

active

06881596

ABSTRACT:
The invention relates to a device and method for automatically determining the surface quality of a bonding interface between two wafers. The device includes a detector for automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site, and a processing unit for automatically calculating the bonding speed based on a location of the measuring site and at least one other predetermined site.

REFERENCES:
patent: 5407856 (1995-04-01), Quenzer et al.
patent: 6197695 (2001-03-01), Joly et al.
patent: 57166505 (1983-01-01), None
patent: 7245470 (1996-01-01), None

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