Method for automatically controlling composition of chemical cop

Details Method for automatically controlling composition of chemical cop Method for automatically controlling composition of chemical cop

1980-10-15

1982-01-12

Hoffman, James R.

Coating processes

Measuring, testing, or indicating

4274301, 427437, C23C 302, B05D 118

Patent

active

043105637

ABSTRACT:
The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH.
A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures.

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