Method for automatic, continuous selective plating on a tape mem

Chemistry: electrical and wave energy – Processes and products

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204 28, C25D 502, C25D 508, C25D 534

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active

040691098

ABSTRACT:
The present invention relates to a method to effect a selective plating automatically and continuously in order to make connecting elements such as connectors or contact elements such as relays. More particularly it relates to a method to conduct a selective plating automatically and continuously at least on one of the upper and lower surfaces of a metal strip member unfolded from a roll, wherein the metal strip is moved intermittently in one direction correspondingly with the intervals at which at least one cleaning nozzle, one vacuum nozzle and one plating nozzle are linearly arranged while it is kept pressed onto the tips of the nozzles.

REFERENCES:
patent: 3294664 (1966-12-01), Franklin
patent: 3723283 (1973-03-01), Johnson et al.
patent: 3860499 (1975-01-01), Graham et al.
patent: 3974056 (1976-08-01), Jogwick

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