Method for attaching solderable wire leads to a lead frame

Details Method for attaching solderable wire leads to a lead frame Method for attaching solderable wire leads to a lead frame

1999-01-27

2000-11-21

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

2281805, 228 61, B23K 3102, B23K 3100, B23K 100, B23K 500

Patent

active

061490504

ABSTRACT:
A method and apparatus for soldering wires of components on PC boards to a lead frame. Wires from the electronic components on a PC board supported by a fixture are led through respective pathways and particularly plated grooves on each side of the PC board. The wires within the pathways are held there by being adhered to a temporary fixture beneath the board until the wires are later affixed in their grooves by dipping the sides of the PC board in a solder pool. The excess wire tails are cut away. The PC board is then mounted on a lead frame, and the leads of the lead frame are aligned with respective pathways of the PC board. The PC board and lead frame are then dipped in solder which electrically connects the wires in their respective pathways to the leads of the lead frame.

REFERENCES:
patent: 3873890 (1975-03-01), Beckman et al.
patent: 4127934 (1978-12-01), Bartley et al.
patent: 4187529 (1980-02-01), Bartley et al.
patent: 4641112 (1987-02-01), Kohayakawa
patent: 5015981 (1991-05-01), Lint et al.
patent: 5521124 (1996-05-01), Tai

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