Method for attaching small components to each other

Details Method for attaching small components to each other Method for attaching small components to each other

1996-08-19

1998-06-02

Bradley, P. Austin

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228227, 2282332, B23K 100, B23K 3102, B23K10318

Patent

active

057588163

ABSTRACT:
A method is provided to heat a plurality of components to a preselected temperature that creates a tackiness at the surface of a preformed solder component and permits the preformed solder component to adhere to a first metallic surface of a first component. When the preselected temperature is reached, the components are rapidly cooled to prevent diffusion that would result from further heating and melting of the preformed solder component. In a particularly preferred embodiment of the invention, the first component is a lens that has a first metallic surface rigidly attached thereto. A second metallic surface is attached to a ceramic body and a preformed solder component is disposed between the first and second metallic surfaces. After a first assembly is formed from the first metallic surface and the preformed solder component that adheres to it, the first assembly is disposed on the second surface and the preformed solder component is completely melted to rigidly attach the first and second metallic surfaces to each other to provide a hermetic seal.

REFERENCES:
patent: 3340602 (1967-09-01), Hontz
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4746583 (1988-05-01), Falanga
patent: 4833102 (1989-05-01), Byrne et al.
patent: 4972988 (1990-11-01), Ohdate

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