Method for attaching semiconductors to a transparent substrate u

Details Method for attaching semiconductors to a transparent substrate u Method for attaching semiconductors to a transparent substrate u

1990-02-01

1991-08-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

29841, 29740, H01L 2184, H01L 2156

Patent

active

050377809

ABSTRACT:
A method for fabricating semiconductor devices comprising pressing first and second semiconductor devices against a transparent board at different times by means of first and second pressure tools that are separate from each other and move upward and downward independent of each other so that a difference in thickness between the devices and a deflection of the devices can be absorbed and a reliable electrical connection between the electrodes of the devices and the conductors of the board can be attained, which makes it possible to continuously achieve a highly dense assembly of semiconductor devices with a minute gap therebetween.

REFERENCES:
patent: 4208005 (1980-06-01), Nate et al.
patent: 4375126 (1983-03-01), Dull et al.
patent: 4451324 (1984-05-01), Ichikawa et al.
patent: 4749120 (1988-06-01), Hatada
Fifth IEE/CHMT International Electronic Manufacturing Technology Symposium, "Design-to-Manufacturing Transfer Cycle", Lake Buena Vista, Fla., Oct. 10-12, 1988, pp. 23-27; K. Hatada et al., a New LSI Bonding Technology, Micron Bump Bonding Assembly Technology.
Patent Abstracts of Japan, vol. 12, No. 174 (E-612), May 24, 1988; & JP-A-62281360 (Matsushita Electric Ind. Co., Ltd.) Dec. 7, 1987.

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