Metal fusion bonding – Process – With supplementary mechanical joining
Patent
1997-08-14
1999-06-15
Ryan, Patrick
Metal fusion bonding
Process
With supplementary mechanical joining
228160, 2281801, 228 62, 174 35R, B23K 3102
Patent
active
059113561
ABSTRACT:
A method of attaching a lead part and a shield case for preventing a high-frequency signal from being leaked to a printed circuit board includes a solder coating step of coating solder so that the solder should cover the whole of an aperture provided through a printed circuit board into which a lead of the lead part is inserted and so that the solder should cover a part of an aperture provided through the printed circuit board into which an engagement portion of the shield case is inserted, a mounting step of inserting the lead of the lead part and the engagement portion of the shield case into the respective apertures to thereby mount the lead part and the shield case on the printed circuit board, and a soldering step of inserting the printed circuit board mounted with the lead part and the shield case into a reflowing furnace and melting the solder to thereby carry out soldering.
REFERENCES:
patent: 4816613 (1989-03-01), Ito et al.
patent: 5160807 (1992-11-01), Fry et al.
patent: 5400949 (1995-03-01), Hirvonen et al.
patent: 5581875 (1996-12-01), Hibino et al.
Knapp Jeffrey T.
Maioli Jay H.
Ryan Patrick
Sony Corporation
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