Method for attaching heat sink to plastic packaged electronic co

Fishing – trapping – and vermin destroying

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437902, 357 81, 165 803, 439487, H01L 2340

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active

049786385

ABSTRACT:
Described is an improvement for thermal enhancement technology for high power dissipating plastic packaged electronic circuit chips derived from providing structural features in the plastic package adapted to snap fit with complementarily formed edges of heat sink members.

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patent: 4408220 (1983-10-01), Calabro
patent: 4552206 (1985-11-01), Johnson et al.
T. J. Demaine et al., "Attachable heat Sink for Pluggable Modules", IBM Technical Disclosure Bulletin, vol. 22, No. 3, 8/79, 00/960-961
S. W. Lee et al., "Low Profile Heat Sink", IBM Technical Disclosure Bulletin, vol. 28, No. 12, May, 1986, pp. 5172-5173.
S. A. Curtis et al., "Surface Mount Chip Packaging", IBM Technical Disclosure Bulletin, vol. 28, No. 12, May, 1986, pp. 5531-5532.

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