Method for attaching disc- or plate-shaped targets to cooling pl

Details Method for attaching disc- or plate-shaped targets to cooling pl Method for attaching disc- or plate-shaped targets to cooling pl

1980-07-11

1982-07-27

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29458, 204298, 228122, 228208, 427423, 204192R, 204192C, B05D 108

Patent

active

043418163

ABSTRACT:
Disc- or plate-shaped targets for sputtering systems are attached to associated cooling plates by plasma-spraying a surface of such target with a compatible adhesive layer, for example composed of Ni; Ni/Cr mixtures; 80/20 Ni/Al mixtures; Ni/Al/Mo mixtures; Al/bronze mixtures; Mo; W; Al/Si mixtures, Zn, Cu, Cu/glass mixtures, etc., and then coating such adhesive layer with a solderable layer, for example composed of Cu, Cu/glass mixture or Ag, etc., and soldering such solderable layer onto the surface of a cooling plate. Preferably, the adhesive layer and the solderable layer are applied via plasma spraying.

REFERENCES:
patent: 3020182 (1962-02-01), Daniels
patent: 3293065 (1966-12-01), Roetter
patent: 3703306 (1972-11-01), LaChance
patent: 3872577 (1975-03-01), Kugler et al.
patent: 3933644 (1976-01-01), Skinner et al.
patent: 4009090 (1977-02-01), Veigel
patent: 4011981 (1977-03-01), Danna et al.
patent: 4209375 (1980-06-01), Gates et al.

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