Method for attaching component leads to printed circuit base boa

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29628, 29630D, 174 685, 361400, 361403, 361406, H05K 304

Patent

active

041853784

ABSTRACT:
A printed circuit base board comprising an insulating substrate having a thin electric circuit layer composed of an electrically conductive material on one surface is disclosed. This printed circuit base board is drilled at parts of the insulating substrate contiguous to component lead attaching land-forming portions of the electric circuit layer from the opposite surface of the printed circuit base board, while leaving the land-forming portions undrilled, so that composite lead-inserting holes having a size sufficient to insert component leads exactly therein and having one end closed on the side of the land-forming portions of the electric circuit layer and the other end opened are formed. Component leads are inserted in these component lead-inserting holes from the open ends thereof, the top ends of these component leads are extended through the land-forming portions to project the top ends of the component leads on the printed circuit base board, and these projected top ends of the component leads are soldered to the land-forming portions of the electric circuit layer.

REFERENCES:
patent: 3022480 (1962-02-01), Tiffany
patent: 3275736 (1966-09-01), Hotine et al.
patent: 3528173 (1970-09-01), Gall
patent: 3619478 (1971-11-01), Staiger
patent: 3745513 (1973-07-01), Gross
patent: 3832769 (1974-09-01), Olyphant
patent: 3882264 (1975-05-01), Travis
patent: 3893233 (1975-07-01), Glover
patent: 4086426 (1978-04-01), Knappenberger

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