Method for attaching chips in a flip-chip arrangement

Details Method for attaching chips in a flip-chip arrangement Method for attaching chips in a flip-chip arrangement

2003-02-21

2009-08-11

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S790000, C361S804000

Reexamination Certificate

active

07573723

ABSTRACT:
Polyimide is used as a spacer that also bonds together the elements that it is spacing apart. This is achieved by constructing the spacer on at least one of the wafers as is conventionally done, except that prior to performing the final curing of the polyimide precursor to form the final polyimide, the elements are aligned in a bonder and placed in contact with a pressure of 40 grams per square millimeter at a temperature slightly higher than the soft-bake temperature, as specified by the manufacturer of the polyimide precursor, for few minutes to promote tackiness. This holds the elements together, and the combined structure is then baked to fully cure the polyimide precursor into polyimide and complete the bonding.

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